Modi pitches India as semicon powerhouse

New Delhi (TIP): New Delhi : Prime Minister Narendra Modi on September 17 pitched India as a reliable base for semiconductor and data centre industries, saying a semiconductor industry in India would matter more to the world at a time when global supply chains were “being weaponised”.
Modi’s comments come days after he used similar phrasing at the Brics Summit in New Delhi, where he raised concerns over technology and critical minerals exports being choked off. While Modi did not name any country, China – whose leader Xi Jinping was at the summit over the weekend – has been criticised by several nations for its restrictions on exports of both rare earths and critical hi-tech equipment in recent years.
“India is the mother of democracy. If a country like India can develop a critical industry such as the semiconductor industry, then it is beneficial for the world. Its importance increases as the supply chain is being weaponised globally,” Modi said, inaugurating the fifth edition of Semicon India at the Yashobhoomi Convention Centre in New Delhi.
India received investment pledges of about Rs 1 lakh crore, said IT minister Ashwini Vaishnaw at a media briefing, including Rs 48,000 crore from semiconductor equipment maker Applied Materials and Rs 10,000 crore from Lam research.
Modi virtually inaugurated Suchi Semicon’s facility in Surat, Gujarat, and CDIL’s facility in Mohali, Punjab, with both units entering commercial production.
Vaishnaw presented him with a memento holding chips from the five units now in commercial production in India: Micron, Kaynes, CG Semi, Suchi Semicon and CDIL.
The event, themed “Silicon to Systems: Building the Ecosystem”, coincided with Modi’s 76th birthday.
Modi said the growing computing demands of AI were creating technical challenges for the industry beyond its traditional focus on transistor size and computing efficiency. Those challenges now extend to what surrounds the processor: placing memory closer to it, connecting several chips with minimal delay, and managing heat and power consumption.
“Today if you are working on AI, challenge is not what is inside the chip, but what is around the chip,” he said.